Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly

Role Overview

We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding.

What You Will Do

Develop and qualify GGI and thermosonic flip-chip / die-attach processes, develop gold stud bump, gold bump, and gold-to-gold interconnect processes, and support related assembly steps.

Why It Might Be a Fit

The ideal candidate will have hands-on experience in semiconductor assembly, IC packaging, or electronics manufacturing, and a strong understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination.

Requirements

• Bachelor’s degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
• 2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience
• 3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
• Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
• Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
• DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
• Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
• Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp