Senior Applications Engineer – Semiconductor 3D X-ray Solutions

Senior Applications Engineer – Semiconductor 3D X-ray Solutions
As an Applications Engineer, you will join an exciting and growing team of scientists, engineers, and research professionals, focused on advancing 3D X-ray solutions for semiconductor applications. You will collaborate closely with customers and internal teams to enable cutting-edge inspection, metrology, and failure analysis workflows.
Key Responsibilities:
Lead system demonstrations for semiconductor customers, including fabs, FA labs, and R&D centers
Develop new applications and methodologies tailored to semiconductor devices, processes, and packaging technologies
Provide critical input to product development by informing system specifications based on customer needs and application gaps
Deliver advanced customer training on system operation, data acquisition, and analysis workflows
Design, develop, and optimize robust workflows for semiconductor inspection and analysis
Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases
Serve as a technical leader in customer-facing support activities, including:
Delivering high-impact technical presentations and demos
Supporting industry conferences and trade shows
Authoring technical papers and presenting at conferences
Customer Base:
Our customers include semiconductor manufacturing facilities (fabs), failure analysis (FA) laboratories, and advanced R&D organizations working at the forefront of device innovation.
Role Impact:
In this role, you will act as a key technical interface between engineering, sales, and marketing, serving as the voice of the semiconductor customer. You will partner with external clients and internal development teams to:
Establish best-in-class workflows for routine semiconductor inspection and analysis
Identify and unlock new applications of 3D X-ray technology across front-end and back-end processes
Solve high-value problems (HVPs) related to yield, reliability, process development, and advanced packaging
Essential Qualifications:
BS or MS degree in a relevant technical field (e.g., Materials Science, Physics, Electrical Engineering, or related discipline)
3–5 years of experience in a semiconductor-related field (e.g., fabs, failure analysis, metrology, or process development)
Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment
Ability and willingness to travel up to 30% (domestic and international)
Preferred Qualifications:
Background in microscopy or advanced imaging techniques (e.g., X-ray CT, SEM, FIB)
Working knowledge of X-ray absorption principles and imaging/optical fundamentals
Experience with semiconductor capital equipment, particularly in inspection, metrology, or FA workflows
Familiarity with advanced semiconductor technologies (e.g., 3D IC, heterogeneous integration, advanced packaging)

Requirements

• BS or MS degree in a relevant technical field
• 3–5 years of experience in a semiconductor-related field
• Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment
• Ability and willingness to travel up to 30% (domestic and international)

Benefits

• Comprehensive benefits package
• Participation in a bonus program
• Participation in a stock award program